中国快讯 (China Crunch) 为中国读者提供及时的加密新闻、市场洞察和监管动态。
Packaging Innovation: China’s Bet on Advanced Chip Assembly
With lithography bottlenecks, focus shifts to breakthroughs in chip packaging and integration. China’s semiconductor strategy in 2025 is increasingly turning toward advanced packaging, the process of stacking, interconnecting, and integrating chips to boost performance. With U.S. sanctions blocking access to the most advanced